A、下料( Cut Lamination)
B、鑽孔(Drilling)
C、乾膜製程( Photo Process(D/F))
D、壓合Lamination
E、減銅(Copper Reduction)
F、電鍍(Horizontal Electrolytic Plating)
G、塞孔(Plug Hole)
H、防焊(綠漆): (Solder Mask)
I、鍍金Gold plating
J、噴錫(Hot Air Solder Leveling)
K、成型(Profile)(Form)
L、短斷路測試(Electrical Testing) (Continuity & Insulation Testing)
M、終檢( Final Visual Inspection)
N、雷射鑽孔(Laser Ablation)

a-1 裁板( Sheets Cutting)
a-2 原物料發料(Panel)(Shear material to Size
b-1 內鑽(Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling )
b-3 二次孔(2nd Drilling)
b-4 雷射鑽孔(Laser Drilling )(Laser Ablation )
b-5 盲(埋)孔鑽孔(Blind & Buried Hole Drilling)